Semiconductor applications

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Semiconductor applications


Silicon carbide (SiC) serves both as a third-generation semiconductor material (for power and radio-frequency devices) and as a critical structural material for semiconductor equipment (such as etching/thermal processing components and lithography stage components). Its advantages lie in its wide bandgap, high thermal conductivity, and high breakdown field strength, making it suitable for high-temperature, high-pressure, high-frequency, and high-radiation environments.

Aluminium oxide (Al₂O₃) primarily serves as high-purity ceramic components and coatings for semiconductor equipment (such as etching chamber linings, electrostatic chucks, nozzles, and polishing plates), as well as CMP polishing abrasives in wafer fabrication processes. It is characterised by high insulation, plasma resistance, chemical stability, and relatively controllable costs.



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